Vinayak P.

Vice President, Product and Technology Marketing | Field Application Engineering

United States of America
EN

Provide corporate leadership in product marketing, technology marketing, sales & business development, corporate strategy, P&L management and product management Product Marketing Technology Marketin...see more

  • Digital & Broadcast Media
  • Electrical Equipments & Components
  • Professional Services

300

/hr
  • Pre-vetted expert
  • Confirmed hourly rate
  • Available on short notice

Experience

Vice President, Product and Technology Marketing/ Field Application Engineering

STATS ChipPAC Ltd.
7 years
Current position
Dec 2014 - Present
Led marketing, business development, product management & field engineering teams • Built a cross functional team matrixed with product marketing, business development and technical pro...see more

Vice President/Senior Director, Flip Chip Product Line, Product and Technology Marketing

STATS ChipPAC
2 years
Dec 2012 - Dec 2014
P&L responsibility for flip chip product line delivering over $500M revenue per year • Grew flip chip product line revenue through market and customer diversification more than 3x over ...see more

Director Business Management

STATS ChipPAC Ltd.
2 years
Dec 2010 - Dec 2012
• Created a central organization in the company to drive financial performance and strategy for all product lines creating consistent strategies and financial planning across all produc...see more

Product Line Manager/Senior Manager Flip Chip, PoP and Stacked die Products

STATS ChipPAC
3 years
Dec 2007 - Dec 2010
• P&L responsibility managing over $200 million in sales revenue • Secured design wins across several sales regions and non-mobile markets • Launched new products into the marketplace t...see more

Senior Packaging Engineer, Mobile Platforms Group

Intel Corporation
3 years
Jun 2005 - Dec 2007
•Managed the customer enabling program for top 10 Original Equipment Manufacturers (OEMs) and top 5 Original Design Manufacturers (ODMs) for new mobile platforms including microprocesso...see more

Packaging/Design Engineer, Assembly Technology Development

Intel Corporation
5 years
Jul 2000 - May 2005
• Designed, tested and analyzed mechanical and thermal enabling design of various components such as microprocessor sockets for desktop, server and mobile platforms and products • Desig...see more

Industries, roles and expertise

Industry experience

  • Digital & Broadcast Media
  • Electrical Equipments & Components
  • Professional Services

Expertise

  • Business Strategy
  • Business Development
  • Management
  • Product Marketing
  • Product Management
  • Engineering Management
  • Six Sigma
  • Cross-functional Team Leadership
  • Customer Relationship Management (CRM)
  • Mechanical Engineering
  • Quality Management
  • Product Design
  • Semiconductors
  • Design of Experiments
  • SPC
  • IC
  • Failure Analysis
  • Product Development